“Historically, the security requirements associated with the development of microelectronics have limited the ability of the United States Department of Defense (DoD) to take advantage of the latest innovations,” wrote in a blog Tom Keane, vice president of Azure Global, Microsoft Azure.
“Through a recent DoD-sponsored project, Rapid Assured Microelectronics Prototypes (RAMP) using Advanced Commercial Capabilities, the goal is to leverage best business practices to accelerate the development process & bring microelectronics design and manufacturing to the next level. reliable and safe cutting edge for national security and defense applications.
This is not the first time that Microsoft & the Department of Defense joined forces. The two entities have worked together for 40 years to bring commercial innovations to national security community.
Microsoft has also previously led a coalition of companies to develop design capabilities that meet Department of Defense mission priorities. This was the first phase of this new initiative.
The second phase will see these entities develop custom integrated chips & a system on a chip (SoC) with “lower power consumption, improved performance, reduced physical size and improved reliability for application in DoD systems.”
Collaborators to this ambitious project include Ansys, Applied Materials, Inc., BAE Systems, Battelle Memorial Institute, Cadence Design Systems, Cliosoft, Inc., Flex Logix, GlobalFoundries, Intel Federal, Raytheon Intelligence & Space, Siemens EDA, Synopsys, Inc ., Tortuga Logic & Zero ASIC Corporation. However, few details have been revealed on how these new chips work and what exactly they consist of.
Microsoft said the new chips will have mission-critical applications, with quantifiable assurance, security, cloud, artificial intelligence, and machine learning enabled automation. Meanwhile, the NSTXL revealed that the Navy & Air Force want to leverage commercial capabilities to develop a prototype RAMP methodology, indicating which government entities are most likely to take advantage of new futuristic chips.